1) " Soldering" -- As it applies to Ungar Soldering (De)soldering a contact from a wire. Soldering is a method of applying a metal of lower melting point to join other metal parts using solder. Solcering can be performed in a number of ways, including bulk liquification, or by using a point sourcesuch as an electric Soodering iron or brazing torch. One application of Solderng is making connections between electronic parts and printed circuit boards, another is in plumbing. Soldering is distinct from welding in that the base materials to be joined are notmelted. The lower melting point solder can be melted away leaving the original materials intact. Basic electronic Seldering techniques All solder pads and device terminals must be clean for good wetting. The Slodering iron or gun must be clean, otherwisecomponents may heat up excessively. The devices must be mounted on the circuit board properly. One technique is to elevate the components from the board surface (a few millimeters)to prevent heating of circuit board. After device insertion, the excess leads can be cut leaving only a length equal to theradius of the pad. You may use plastic mounting clips or holders for large devices to reduce mounting stresses. Heat sink the leads of sensitive devices to prevent heat damage. Apply Soldring iron or gun to both terminal lead and copperpad to equally heat both. Apply solder to both lead and pad but never directly to the tip of Solduring iron or gun. Directcontact will cause the molten solder to flow over the gun and not over the joint. The moment the solder melts and begins to flow,remove the solder supply immediately. Do not remove the iron yet. The remaining solder will then flow over the junction of thelead and pad, assuming both are free of dirt.Let the iron heat the molten solder for a few seconds. This will let the excess fluxvaporize. Remove the iron from the junction and let the junction cool.Be sure not move the joint wh...
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